March 15: Distinguished Talk from Intel

BIO
Vinoo Srinivasan is Vice President and GM for the System Software and Simulation Engineering (S3E) group in DEG. Vinoo is responsible for the quality of the system architecture and system software meeting production readiness ahead of the first silicon. His group delivers system simulators, including functional, power, performance thermal, and related technologies. The team supports Intel’s internal and external partners for all major Intel products from early architecture pathfinding stages to post-product launch. Vinoo passionately drives automation and DevOps, delivering simulation-as-a-service on the cloud, and adopting AI/ML to solve complex simulation challenges. He has held leadership roles in design, manufacturing testing, and system architecture teams. Vinoo received his Ph.D. in Computer Science and Engineering from the University of Cincinnati.

BIO
Nick is a Principal Engineer in the Mechanical and Process Core Competency team within ATTD. He holds a PhD in Engineering Physics from the University of Wisconsin – Madison. Since joining Intel in 2012, he has supported assembly and process development for ATTD, leading to 24 patents across a range of disciplines. He has developed several first-of-a-kind predictive capabilities that have impacted several key ATTD projects, including Embedded Interconnect Bridge (EmIB) technology. Presently, he is the mechanical lead for Intel’s glass core substrate technology while also spearheading the development and application of Digital Twins across ATTD. This initiative is particularly crucial given the increased need for heterogeneous integration and Intel’s pivot to the foundry business.