CHIPS R&D Office announced two Notices of Intent (NOI) for upcoming funding opportunities for the CHIPS Manufacturing USA Institute and the National Advanced Packaging Manufacturing Program.
NOTICE OF INTENTS
CHIPS Manufacturing USA Institute:
“CHIPS for America is investing at least $200 million in a CHIPS Manufacturing USA Institute to create the first-of-its-kind digital twin institute to lead the world in revolutionizing semiconductor and advanced packaging manufacturing.”
National Advanced Packaging Manufacturing Program (NAPMP):
“The U.S. Department of Commerce has issued a Notice of Intent to announce a competition for new research and development (R&D) activities to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for packaging semiconductors. The CHIPS for America program anticipates awarding approximately $300 million in funding for multiple projects in substrates and substrate materials research.”
We encourage you to read the details of these opportunities here: NIST.gov
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