We have multiple research activities focused on designing dielectric materials for high frequency and high thermal conductive interconnected substrates. These include polymers, polymer ceramic composites, and glass and ceramic substrates that can be assembled with multilayer structures and or 3D printed structures packaging devices. Combining new processing methods such as cold sintering offer unique opportunities in the integration of all classes of materials to significantly overcome limitations with traditional packaging solutions.

Center for Heterogeneous Integration of Micro Electronic Systems at Penn State

The Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES) brings together fifteen universities to advance monolithic 3D and heterogeneous integration, the efficient and effective integration and packaging of semiconductor devices, chips, and other components. This center is supported through Semiconductor Research Corporation (SRC)’s Joint University Microelectronics Program 2.0 (JUMP 2.0), a consortium of industrial partners in cooperation with the Defense Advanced Research Projects Agency (DARPA).
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