MASH Areas of Research for America’s Semiconductor Future
Digital Twinning
In the context of semiconductor manufacturing, digital twinning can be used to improve the efficiency, quality, and yield of the production process. A digital twin of a semiconductor production line can be used to simulate the manufacturing process, identify bottlenecks and inefficiencies, and test different scenarios to optimize the process. This can help to reduce the time and cost of bringing new products to market, while also improving the performance and reliability of the final product.
Recent research in digital twinning:
Digital Innovation Lab – the lab will help local industry partners develop digital “twinning,” the simulated representation of a product before it’s manufactured, which reduces cost and shortens time to market.
SMORES-EP – Designing autonomous robots that change shape to adapt to challenging environments
Quantum Packaging
We have multiple research activities focused on designing dielectric materials for high frequency and high thermal conductive interconnected substrates. These include polymers, polymer ceramic composites, and glass and ceramic substrates that can be assembled with multilayer structures and or 3D printed structures packaging devices. Combining new processing methods such as cold sintering offer unique opportunities in the integration of all classes of materials to significantly overcome limitations with traditional packaging solutions.
Recent research in packaging:
Ferroelectric Microelectronics
Our research and development programs target technology that uses the third dimension in microelectronics for non-volatile 3D memory above CMOS logic to create memory devices densely interconnected with logic to enable lowpower, 3D non-von Neumann computation.
Micro-mechanical Systems (MEMS)
We are developing a new generation of micro-mechanical systems and devices that would incorporate shape-morphing materials to sense the environment,
interact with each other, and perform self-coordinated tasks, with applications in communications, timing, and Internet of Things.
Metrology